Kathleen Dunn

Selected Publications

1. M. Zulqarnain, W. Zheng, O. I. Lebedev, J. F. Berry, M. Hollo, K. A. Dunn, E. V. Dikarev; Cation-Distribution Engineering for High-Performance Noble Metal-Free Electrochemical Water Oxidation. Inorg. Chem. Front. 2026
2. J. Nhan, S. Hur, D. MacLeod, A. Biedron, G. Denbeaux and K.A. Dunn “Solvent-assisted transport of photo-acid generators in extreme ultraviolet photoresists and underlayers,” J. Micro/Nanopattern. Mater. Metrol. 25(3), 034604 (2026)
3. S. Singh and K.A. Dunn, “Microstructural and Thermo-Mechanical Behavior of Cu-Al Bilayer Alloys for Low-Temperature Hybrid Bonding,” 2026 IEEE Internat. Conf. on Electronics Packaging  and Hybrid Bonding Symposium (ICEP-HBS) 2026, 365 (2026)
4. J. Nhan, S. Hur, D. MacLeod, A. Biedron, G. Denbeaux and K.A. Dunn “Solvent-assisted transport of PAG in EUV photoresists and underlayers,” Proc. SPIE 13983, Advances in Patterning Materials and Processes XLIII, 139831N (2026). 10.1117/12.3090881
5. S.S.K.N. Bharathi, E. Limani, A. Bonacci, J. Arnason, M. Armstrong and K. Dunn, “Modeling and Experimental Investigation of Factors Affecting CRUD Deposition in PWRs: Role of Zn, Ni, and Redox Potential,” Corrosion 82(5)
6. M. Zulqarnain, Z. Wei, M. Hollo, K.A. Dunn, E.V. Dikarev, “Molecular Precursor Synthesis of the Rh2O3/Fe2O3 Spherical Architecture for Enhanced Acidic HER Activity and Durability,” Chem. Sci. 16(40), 18695 (2025)
7. S. Singh and K. Dunn, “The Effect of Cobalt Incorporation on the Microstructure and Properties of Cu(Co) Alloys for Use in Hybrid Bonding,” Metals 2025, 15, 1023 (2025)
8. S.S.K.N. Bharathi, E. Limani, A. Bonacci, J. Arnason, M. Armstrong, and K.A. Dunn "Modeling and Experimental Investigation of Factors Affecting CRUD Deposition in PWRs: Role of Zn, Ni, and Redox Potential," Proceedings of Environmental Degradation 2025, 1 (2025)
9. S. Singh and K. Dunn, “Tuning of Copper Grain Sizes for Integration in Hybrid Bonding Applications,” 2024 IEEE Electronics System-Integration Technology Conference Papers,  10.1109/ESTC60143.2024.10712147
10. S. Singh and K. Dunn, “Composition-Tunable Properties of Cu(Ag) Alloy for Hybrid Bonding Applications,” Materials 16(23), 7481 (2023)
11. B. S. Nagothi, J. Arnason, and K. A. Dunn, “A Hydrothermal Phase Diagram for the Low-Temperature Synthesis of Non-stoichiometric Nickel Ferrite Powders,” Nuclear Technology 209(6), 887-894 (2023)
12. T. Jiang, S. Singh, K. A. Dunn, and Y. Liang, “Optimizing Leaching of Rare Earth Elements from Red Mud and Spent Fluorescent Lamp Phosphors Using Levulinic Acid,” Sustainability 14(15), 9682 (2022)
13. S. Rogalskyj, H. Frost, L. Melican, A. Palka, N. Joy, D. Triyoso, R. Clark, C. Wajda, G. Leusink, A. Raley, and K. Dunn, “Plasma-Induced Roughness and Chemical Modification of TiN Bottom Electrode and Their Impact on HfO2-MIM Properties,” Proceedings of the 2020 International Interconnect Technology Conference. Winner, Best Student Paper
14. C. Netzband and K. Dunn, “Improving Ruthenium Polishing Through the Use of Ceria Abrasives,” Proceedings of the 2020 International Interconnect Technology Conference (virtual), September 8, 2020
15. A. Reiser, L. Koch, K. A. Dunn, F. Iwata, O. Fogel, Z. Kotler, N. Zhou, K. Charipar, A. Pique, P. Rohner, D. Poulikakos, S. Lee, S.K. Seol, I. Utke, C. van Nisselroy, T. Zambelli, J.M. Wheeler and R. Spolenak, “Metals by Micro-Scale Additive Manufacturing: a Comparison of Microstructure and Mechanical Properties,” Adv. Funct. Mater. 30(28), 1910491 (2020)
16. C.M. Netzband and K. Dunn, “Controlling the Oxidation State During Silicon Oxide CMP to Improve Material Removal Rate and Roughness,” ECS J. Solid State Sci. Tech. 9, 044001, 2020
17. C. Netzband and K. A. Dunn, “Investigation into the Effect of CMP Slurry Chemicals on Ceria Abrasive Oxidation State using XPS”, ECS J. Solid State Sci. Tech. 8(10): P629 (2019)
18. M. Kubota, K. Takanashi and K. A. Dunn, “Evaluation of Particle Agglomeration Level in CMPS Slurry for Silicon Wafers and Investigation of these Effects on the Polishing Behaviors,” Proceedings of the 2019 International Conference on Planarization/CMP Technology
19. C. Netzband and K. A. Dunn, “Improving BEOL Metal Polishing through the Use of Ceria Abrasives,” Proceedings of the 2019 International Conference on Planarization/CMP Technology. Winner, Best Student Presentation
20. T. Tsurumaru, L. Prestowitz, B. O’Brien and K. Dunn, “The Impact of Solute Segregation on Grain Boundaries in Dilute Copper Alloys,” Proceedings of the 2018 International Interconnect Technology Conference (IITC) (2018)
21. S. Papa Rao, C. Hobbs, S. Olson, N. Foroozani, H. Chong, H. Stamper, B. Martinick, D. Ashworth, B. Bunday, M. Malloy, E. Holland, J. Nalaskowski, T. Ngai, I. Wells, M. Yakimov, S. Oktyabrsky, B. O’Brien, V. Kaushik, K. Dunn, K. Beckmann, S. Bennett, M. Rodgers, T. Murray, S. Novak, B. Baker-O’Neal, C. Borst, K.D. Osborn, and M. Liehr, “(Invited) Materials And Processes For Superconducting Qubits And Superconducting Digital Electronic Circuits On 300mm Wafers”, Electrochemical Society Transactions 85(6), pp. 151-161 (2018)
22. Tsurumaru, L. Prestowitz, B. O’Brien and K. Dunn, “The impact of solute segregation on grain boundaries in dilute copper alloys,” to appear in the Proceedings of the 2017 Advanced Metallization Conference.
23. B. O’Brien, M. Rizzolo, L. C. Prestowitz and K.A. Dunn, “Rapid Trench Initiated Recrystallization and Stagnation in Narrow Cu Interconnect Lines,” Appl. Phys. Lett. 107, 171906 (2015)
24. Ryan, K. Dunn, J. van Eisden and J. Adolf, “Properties of PEG, PPG and Their Copolymers: Influence on Copper Filling of Damascene Interconnects,” J. Electrochem. Soc. 160(12), D3186 – D3196 (2013)
25. O’Brien, E. Lifshin and K. A. Dunn, “Sidewall Texture and Microstructure of iPVD Copper Seed in Narrow Damascene Trenches,” J. Electrochem. Soc. 160(12), D3139-D3144 (2013). 10.1149/2.023312jes
26. Qiao, B. B. O’Brien, K. A. Dunn, and A.C. West, “The effect of Fe(III)/Fe(II) Redox Couple on Nucleus Density during Cu Electrodeposition Process,” J. Electrochem. Soc. 160(6), D271-D278 (2013)
27. Rizzolo, S. Novak and K. A. Dunn “Copper Multilayers for the investigation of subsurface impurity redistribution and resultant microstructure,” Appl. Phys. Lett. 103, 051908 (2013)
28. Y. Hung, M. Wormington, K. Matney, P. Ryan, K. Dunn, A. Wang, R. Hill., M-H. Wong, J. Price, W-E. Wang, and G. Bersuker, “Application of Inline X-ray Metrology for Defect Characterization of III-V/Si Heterostructures,” ECS Trans. 50(6), 341-350 (2013)
29. Bresin, M. Toth and K. A. Dunn, “Direct-write 3D Nanolithography at Cryogenic Temperatures,” Nanotechnology 24(3), 03501 (2013)
30. Rizzolo, S. Novak, E. Lifshin, and K. A. Dunn, “Correlating surface segregation and microstructural evolution of electrochemically deposited copper,” Appl. Phys. Lett. 101, 101901 (2012)
31. Volov, E. Swanson, B. O’Brien, S. W. Novak, R. van den Boom, K. Dunn and A.C. West, “Pulse-Plating of Copper-Silver Alloys for Interconnect Applications,” J. Electrochem. Soc.159(11), D677-D683 (2012)
32. Ryan, K. A. Dunn, and J. van Eisden, “Development of Electrochemical Copper Deposition Screening Methodologies for Next Generation Additive Selection,” Microelectron. Eng. 92, 91-94 (2012).
33. Manna, I.C. Noyan, Q. Zhang, I.F. Salakhutdinov, K. A. Dunn, S.W. Novak, R. Moug, M.C. Tamargo, G.F. Neumark, I.L. Kuskovsky, “Structural properties and spatial ordering in multilayered ZnMgTe/ZnSe type-II quantum dot structures,” J. Appl. Phys. 111(3), 033516-1 - 033516-7 (2012)
34. Carlsen, S. Higashiya, N.I. Topilina, K. A. Dunn, R.E. Geer, E.T. Eisenbraun, A.E. Kaloyeros and J.T. Welch, “Metallization of a Genetically Engineered Polypeptide,” Macromolecular Bioscience 12(2), 269-273 (2012)
35. Ryan, K. Dunn and J. van Eisden, “Development of electrochemical copper deposition screening methodologies for next generation additive selection,” Proc. 2011 MRS Spring Meeting 1335, 105-110 (2012)
36. E. Kaloyeros, E.T. Eisenbraun, K. Dunn and O. van der Straten, “Zero Thickness Diffusion Barriers and Metallization Liners for Nanoscale Device Applications,” Chem. Eng. Communications 198 (11) pp. 1453-1481 (2011)
37. Bresin, B.L. Thiel, K. A. Dunn and M. Toth, “Focused Electron Beam-Induced Deposition at Cryogenic Temperatures,” J. Mater. Res. 26(3), 357-364 (2011)
38. Vartanian, P. McClure, V. Mancevski, J. J. Kopanski, P. D. Rack, I. Sitnisky, M. Bresin, V. LaBella and K. Dunn, “Conductive Carbon Nanotubes for Semiconductor Metrology,” Proc. of SPIE 7767, 77670F-1-15 (2010)
39. Li, M. Toth, K. A. Dunn, and B. L. Thiel, “Interfacial mixing and internal structure of Pt-containing nanocomposites grown by room temperature electron beam induced deposition,” J. Appl. Phys. 107 (10), 103540-103545 (2010)
40. Botman, C.W. Hagen, J. Li, B.L. Thiel, K. A. Dunn, J.J.L. Mulders, S. Randolph, and M. Toth, “Electron postgrowth irradiation of platinum-containing nanostructures grow by electron beam-induced deposition from Pt(PF₃)₄,” J. Vac. Sci & Tech. B 27(6), 2759-63 (2009)