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Groundbreaking nanotechnology research at CNSE spurs more than 60 technical papers at leading worldwide forum

Researchers from CNSE and its global corporate partners will present innovations at SPIE Advanced Lithography 2012

Albany, NY – Faculty and corporate scientists working at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany continue to break new ground in nanotechnology-enabled innovation and discovery, with research conducted at the UAlbany NanoCollege contributing to more than 60 scientific and technical papers to be presented next week at the world’s leading lithography forum.                            

The SPIE Advanced Lithography 2012 conference will feature the presentation of technical papers resulting from groundbreaking research performed by scientists from CNSE and its global corporate partners located at CNSE’s Albany NanoTech Complex, including IBM, SEMATECH, GlobalFoundries, Tokyo Electron Ltd., Applied Materials, Novellus Systems, ASML, Dow Electronics and Nanometrics. They include a number of papers that result from collaborative programs involving research teams from CNSE and its industrial partners.

The papers focus on leading-edge innovations that address many of the challenges now facing lithography researchers. Topic areas include 193nm and extreme ultraviolet (EUV) photoresist materials development, mask blanks and process technologies for EUV lithography, and photoresist outgassing; double-patterning techniques for optical microlithography; lithographic techniques studying lens heating; and advances in electron-beam (e-beam) lithography.

“A product of the strategic vision and pioneering leadership of Governor Cuomo and Assembly Speaker Silver, the research being conducted at the UAlbany NanoCollege is continuing to push the boundaries of nanotechnology-enabled discovery and exploration,” said Richard Brilla, CNSE Vice President for Strategy, Alliances and Consortia. “The fruits of this groundbreaking public-private partnership are accelerating new technologies that meet the critical challenges of CNSE’s global corporate partners, while further establishing New York as the place to be in the 21st century economy catalyzed by nanotechnology innovations.”

Also at the event, CNSE graduate Craig Higgins will be honored with the “2011 Hiroshi Ito Memorial Best Student Paper Award in Resist Materials and Processing Technology.” His paper, “Coefficient of thermal expansion (CTE) in EUV lithography: LER and adhesion improvement,” resulted from a joint research project funded by SEMATECH. Higgins received his Ph.D. in Nanoscience from CNSE last May and is now working as a principal EUV lithography engineer at GlobalFoundries.

The 38th annual SPIE Advanced Lithography conference, the world’s premier nanoelectronics lithography conference and exhibition, is being held February 12 through 16 at the San Jose Convention Center and San Jose Marriott in California.


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